| Selective Emitter In a standard doping process, silicon wafers are doped with phosphorus to create a P/N junction. The level of doping concentration was a trade-off between conductivity with the cell electrodes and carrier charge recombination. Higher concentration levels leads to higher conductivity, but more carrier charge losses, and vice versa. As a solution, Mitsubishi Electric has introduced a new selective emitter process in which only the area in contact with the electrodes is doped with high concentrations to maintain both high conductivity and low carrier charge losses. This improvement has resulted in an increase in cell output of approximately 5%. |
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| Half-cut Cell By reducing the area of each cell and connecting them in a parallel formation, the amount of electrical current carried by each busbar is reduced by half. This results in the decreased of electrical resistance within the busbars and an increase in overall efficiency of about 2.5%. |
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| 4 Busbar Cell Through an industry-leading innovation of integrating 4 busbars into each cell, internal electrical resistance is reduced, boosting cell output by 3%*. This is possible because the distances between the busbars are shorter and less current flows through each smaller electrode where resistance is the highest. *Approximate improvement compared to a standard 2 busbar cell. |
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| Newly Re-designed Junction Box Our field-proven high safety junction box has been re-designed and optimized for use with monocrystalline cells. As one of the most critical parts of the module in terms of safety, our junction box features a waterproof, flame-resistant 4 layer barrier of protection. Combined with highly heat-resistant diodes, efficient heat-sink, and secured intertwining tab connections, our junction boxes boast a top-class level of safety. |
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| Anti-reflective Glass An anti-reflective coating has been added to the glass of our modules. It improves the light transmittance of the glass by reducing the amount of reflection on the surface. This improvement has led to a module output increase of 2%. Furthermore, Mitsubishi Electric modules use a non-porous type of anti-reflective coating, which is more resistant to the adhesion of dust than porous types. |
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| Lead-free Solder Mitsubishi Electric was the first Japanese manufacture to introduce (and still use) 100% lead-free solder in the inter-cell connections as another initiative contributing to environmental protection. |